Manufacturing processes of service boxes and their parts
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 9, 2001
Grant Date -
N/A
app pub date -
Nov 8, 1999
filing date -
May 9, 1997
priority date (Note) -
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Abstract
A method for welding electronic components (13) to a circuit board (10) having two conductive layers (12) includes the steps of inserting an electronic component (13) into a first surface of circuit board (10), welding the electronic component (13) to a first conductive face of the circuit board (10) using a first welding material (20), and subsequently welding the electronic component (13) to a second conductive face of the circuit board (10) using a second welding material (22) having a melting point lower than that of the first welding material (20).
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