Method and apparatus for chip removal
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 9, 2001
Grant Date -
N/A
app pub date -
Jan 14, 2000
filing date -
Jan 15, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Chip enclosure (150) wherein the interior portion comprises a primary suction port (152) and a secondary suction port (154). Both primary suction port and secondary suction port are connected via a short neck portion (155) to outlet (156) that is in communication with a source of vacuum. The bulk of chips formed as a result of machining are captured by the primary suction port (152) while any remaining chips fall to the lowest location of the chip enclosure (150) where they are drawn in to the secondary suction port (154).
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