Apparatus and method of applying resist
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United States of America Patent
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Oct 9, 2001
Grant Date -
N/A
app pub date -
Nov 12, 1999
filing date -
Nov 20, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A resist solution applying apparatus and a method of using the resist solution applying apparatus. The apparatus comprises a hold and rotate member that holds and rotates a member to be processed, a resist solution discharge nozzle that discharges a resist solution almost at a center of rotation of the member to be processed, a resist solution supply mechanism that supplies the resist solution to the resist solution discharge nozzle, and a discharge controller connected to the rest solution supply mechanism that controls a predetermined amount of the resist solution discharged from the resist solution discharge nozzle to be reduced gradually or in stages after discharge is started, and increased again before the discharge is stopped.
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