Method of forming resist film

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United States of America Patent

PATENT NO 6300043
SERIAL NO

09200742

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Abstract

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A method of forming a resist film comprises (a) forming a resist film on a substrate, and (b) removing a surface region of the resist film formed in the step (a) so as to decrease the thickness of the resist film.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Keizo Kofu, JP 28 1040
Konishi, Nobuo Yamanashi-ken, JP 30 1167

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