Method for producing semiconductor device by coating
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 9, 2001
Grant Date -
N/A
app pub date -
Mar 30, 2000
filing date -
Mar 30, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic part is disposed in a space defined by upper and lower frames joined together. The upper frame has an opening portion, and a hollow packing member is disposed in the opening portion to expose a specific region of the electronic part. The upper and lower frames are further covered with a cover having a window portion at a position corresponding to the hollow portion of the packing member. In this state, a thin film is formed through the hollow portion to coat the specific region of the electronic part. The thin film is not adhered to the upper and lower frames. Accordingly, the upper and lower frames can be reused to form the thin film onto another electronic part successively.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully