Polishing compound and a method for polishing
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United States of America Patent
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Oct 9, 2001
Grant Date -
N/A
app pub date -
Apr 22, 1999
filing date -
Apr 24, 1998
priority date (Note) -
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Abstract
The present invention is a polishing compound comprising a colloidal solution containing 1.about.15 wt. % of silicon oxide particles of 8.about.500 nanometer average diameter, wherein said colloidal solution is prepared as a buffer solution which has buffering action between pH 8.7.about.10.6 by the addition of one combination selected from groups composed by weak acid and strong base, strong acid and weak base or weak acid and weak base, and logarithms of reciprocal number of acid dissociation constant at 25.degree. C. of said weak acid and/or weak base is 8.0.about.12.0.
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