Methods of making compliant interfaces and microelectronic packages using same
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United States of America Patent
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Oct 9, 2001
Grant Date -
N/A
app pub date -
Apr 16, 1999
filing date -
Apr 17, 1998
priority date (Note) -
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Abstract
A method of making a compliant interface includes providing a support structure and forming a plurality of compliant pads on the support structure by moving a sheet or mold having apertures toward a layer of flowable composition disposed on the support structure. A method of making a microelectronic package includes juxtaposing a microelectronic element with the compliant interface. Leads are formed between the microelectronic element and the substrate. An encapsulant may be disposed between the microelectronic element and the substrate.
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