Edge connectable metal package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 9, 2001
Issued Date -
N/A
app pub date -
May 5, 1995
filing date -
Aug 21, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposing end of the interconnection means extends to the package perimeter for interconnection to a socket or brazing to external leads.
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