Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same
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United States of America Patent
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-
Oct 9, 2001
Grant Date -
N/A
app pub date -
Dec 14, 1999
filing date -
Dec 21, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A small size electronic part comprises a silicon substrate having a functional element and a signal output portion to output a signal from the functional element to outside the electronic part; a glass substrate provided on the silicon substrate such that the signal output portion of the silicon substrate is in contact with the glass substrate; a communicating hole provided in the glass substrate and at least a portion of the signal output portion of the silicon substrate so as to pass through the glass substrate and cut into at least a part of the signal output portion; and a conductive film provided on an inner wall surface of the communicating hole and extending on a surface of the glass substrate.
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