Flexible substrate for packaging a semiconductor component
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United States of America Patent
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-
Oct 9, 2001
Grant Date -
N/A
app pub date -
Jun 1, 1998
filing date -
Jun 1, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).
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