Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process
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United States of America Patent
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Oct 9, 2001
Grant Date -
N/A
app pub date -
Apr 5, 1999
filing date -
Apr 5, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The present invention comprises a single-substrate multiple chip module (MCM) assembly. The MCM assembly includes a repair-package-site ready MCM board having a top surface and a bottom surface, the top surface further includes a plurality of chip connection trace lines include a chip-select line. The MCM assembly further includes a plurality of bare integrated circuit (IC) chips mounted directly on the top surface of the MCM board each chip connected to the plurality of chip connection trace lines on the top surface. The repair-package-site ready MCM board further includes at least a repair-package-site disposed on the bottom surface having a plurality of connection terminals arranged according to a standard repair packaged-chip footprint. Each of the connection terminals is connected to a via connector disposed in the MCM board for electrically connecting to the conductive trace lines on the top surface. The MCM assembly further includes a chip-select jumper means for disconnecting the chip select line for one of the bare IC chips as a disconnected chip and to connect to one of the repair-package-site provided for mounting a repair packaged-chip onto the bottom surface.
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