Thin microelectronic substrates and methods of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 16, 2001
Grant Date -
N/A
app pub date -
Jun 7, 2000
filing date -
Jun 7, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microelectronic substrate and method for manufacture. In one embodiment, the microelectronic substrate includes a body having a first surface, a second surface facing a direction opposite from the first surface, and a plurality of voids in the body between the first and second surfaces. The voids can extend from the first surface to a separation region beneath the first surface. At least one operable microelectronic device is formed at and/or proximate to the first surface of the substrate material, and then a first stratum of the microelectronic substrate above the separation region is separated from a second stratum of the microelectronic substrate below the separation region. The first stratum of the microelectronic substrate can be further separated into discrete microelectronic dies before the first stratum is separated from the second stratum. In one aspect of this embodiment, the substrate can support a film and microelectronic devices can be formed in the film and/or in the substrate.
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