Semiconductor wafer and method for manufacturing semiconductor devices
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United States of America Patent
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Oct 16, 2001
Grant Date -
N/A
app pub date -
Mar 9, 2000
filing date -
Mar 11, 1999
priority date (Note) -
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Abstract
A method for dividing a semiconductor wafer which is covered by an opaque resin in a dicing process includes forming marks on the semiconductor wafer, wherein the marks are distinguished from electrodes which are formed on the semiconductor wafer. According to the method, in a dicing process, separating semiconductor chips from the semiconductor wafer can be precisely achieved.
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