Via connector and method of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 16, 2001
Issued Date -
N/A
app pub date -
Aug 25, 2000
filing date -
Mar 20, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The plated via is filled with an electrically conductive fill composition. A conductive cap layer is formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
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