Face-down bonding pin diode
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United States of America Patent
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Oct 16, 2001
Issued Date -
N/A
app pub date -
Sep 30, 1999
filing date -
Mar 14, 1997
priority date (Note) -
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Abstract
A face down bonding PIN diode having a semiconductor main body; a first region of a conductivity type, a surface of the first region being exposed at a first surface of a semiconductor main body; a third region of a conductivity type opposite that of the first region, the third region being positioned under the first region; a fifth region of substantially intrinsic semiconductor, the fifth region being positioned between the first region and the third region; a fourth region of the same conductivity type, the fourth region being extended vertically from the first surface to the third surface; a first electrode provided on a predetermined surface of the semiconductor main body connected to the first region; and a second electrode provided on the predetermined surface of the semiconductor main body, the second electrode being connected to the fourth region and connected to the third region through the fourth region.
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