Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
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United States of America Patent
Stats
-
Oct 23, 2001
Issued Date -
N/A
app pub date -
Aug 27, 1999
filing date -
Feb 7, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. In one embodiment, there are more ink feed holes than ink ejection chambers, so that more than one ink feed hole provides ink to each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers.
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