Connection component and method of making same
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United States of America Patent
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Oct 23, 2001
Grant Date -
N/A
app pub date -
Sep 15, 1999
filing date -
Sep 15, 1998
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of making a connection component for a microelectronic element includes providing a sheet comprising an electrically conductive layer, a photoresist layer overlying the conductive layer and a photoimageable dielectric layer disposed under the conductive layer. The method includes lithographically forming at least one opening in the photoresist layer to uncover a portion of the conductive layer, forming a plurality of circuit features from the conductive layer by removing the uncovered portion of the conductive layer, at least some of the circuit features being leads, and lithographically forming at least one aperture in the photoimageable dielectric layer.
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