Semiconductor chip package with expander ring and method of making same
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United States of America Patent
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Oct 30, 2001
Grant Date -
N/A
app pub date -
Feb 5, 1999
filing date -
Feb 5, 1998
priority date (Note) -
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Abstract
A method of making a semiconductor chip assembly, including providing a dielectric element with a plurality of electrically conductive terminals, disposing an expander ring over the dielectric element so that a semiconductor chip on the dielectric layer is disposed in a central opening in the expander ring, and disposing an encapsulant in the gap between the expander ring and the semiconductor chip. The size of the gap is controlled to minimize the pressure exerted on the leads by the elastomer as it expands and contracts in response to changes in temperature. The semiconductor chip and expander ring may also be connected to a heat sink or thermal spreader with a compliant adhesive.
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