Fabricating low K dielectric interconnect systems by using dummy structures to enhance process
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United States of America Patent
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Oct 30, 2001
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N/A
app pub date -
Aug 10, 1999
filing date -
Sep 30, 1997
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Abstract
The present invention relates to semiconductor devices. More specifically, the invention discloses the use of dummy structures to improve thermal conductivity, reduce dishing and strengthen layers formed with low dielectric constant materials.
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