Low-fire microwave dielectric compositions
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United States of America Patent
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Oct 30, 2001
Grant Date -
N/A
app pub date -
Apr 28, 1999
filing date -
Apr 28, 1999
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Abstract
The present invention relates to a dielectric composition which can be densified at a temperature no higher than 1000.degree. C. and can provide ceramic products with a dielectric constant of 20 to 45 and a quality constant of 1000 to 1300 at 7 GHz. The dielectric composition comprises 20-90 vol % borosilicate glass and 10-80 vol % TiO.sub.2 ceramic. Multilayered microwave dielectric ceramic elements can be prepared by mixing the composition of the present invention with an organic solvent, a polymer binder and a plasticizer, forming a green sheet from the mixture by tape casting, screen-printing and laminating the green sheet, and then cofiring the multilayer ceramic laminate with a high electrical conductivity metal, such as Ag and Cu.
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