Thermoelectric semiconductor material, thermoelectric element, method of manufacturing these and method of manufacturing thermoelectric module and device for manufacturing thermoelectric semiconductor material
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United States of America Patent
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Nov 6, 2001
Grant Date -
N/A
app pub date -
Oct 8, 1999
filing date -
Oct 12, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
Powder of a semiconductor material and solvent are packed into a rubber tube and both ends of the rubber tube are fixed by fixing rings in a condition with sealing in the vertical direction effected by an upper cover and a lower cover. After this, the rubber tube is immersed in an oil bath and pressure is applied uniformly from the side faces to the semiconductor material within the rubber tube, using hydraulic pressure. An extrusion molding of rectangular shape and of smaller cross sectional area than before molding is formed by extrusion from an extrusion port of rectangular solid shape of a die (extrusion mold) in which pressure is applied in an extrusion direction D by a punch to a rectangular solid sintered body of thermoelectric semiconductor material.
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