Laser cutting method and laser cutter
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 6, 2001
Grant Date -
N/A
app pub date -
Dec 17, 1999
filing date -
Jun 20, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A development of a laser cutting method and a laser cutter in which the adverse effects such as self burning to the cutting surface can be prevented, when the material is cut at a high speed, has been desired. In order to achieve the object, the present invention provides a laser cutting method and a laser cutter in which a cutting laser beam 22 is applied to a material 25 to be cut at a cutting point 26, while ejecting gases 23 and 24 to the cutting point 26 or its surrounding area from a plurality of nozzle openings 30 and 31 arranged in a ring or in a line, wherein the oxygen concentrations of the gases 23 and 24 ejecting from at least one of the nozzle opening 30 and 31 are changed to adjust the oxygen concentration distribution in an area within several millimeters of the cutting point 26; thereby the cutting quality can be improved.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully