Semiconductor structure having stacked semiconductor devices
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United States of America Patent
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-
Nov 6, 2001
Grant Date -
N/A
app pub date -
Aug 28, 1998
filing date -
Aug 28, 1998
priority date (Note) -
In Force
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Abstract
A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
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