Bump bonding and sealing a semiconductor device with solder
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United States of America Patent
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-
Nov 6, 2001
Grant Date -
N/A
app pub date -
Aug 7, 1998
filing date -
Aug 8, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
On a circuit chip on which a processing circuit for sensor outputs is formed, bump electrodes and a sealing bump, which has a shape of rectangular frame and is arranged to surround the bump electrodes, are formed by Sn--Pb solder. On a sensor chip provided with a sensing portion, electrode pads to be bonded to the bump electrode and a joining pad to be bonded to the sealing bump are formed. When the sensor chip is connected onto the circuit chip, an air-tight space containing the sensing portion is formed by the sealing bump and the joining pad.
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