Device and method for isolating a short-circuited integrated circuit (IC) from other IC's on a semiconductor wafer

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United States of America Patent

PATENT NO 6313658
SERIAL NO

09083819

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Abstract

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A circuit for isolating a short-circuited integrated circuit (IC) formed on the surface of a semiconductor wafer from other ICs formed on the wafer that are interconnected with the short-circuited IC includes control circuitry within the short-circuited IC for sensing the short circuit. The control circuitry may sense the short circuit in a variety of ways, including sensing excessive current drawn by the short-circuited IC, and sensing an abnormally low or high voltage within the short-circuited IC. Switching circuitry also within the short-circuited IC selectively isolates the short-circuited IC from the other ICs on the wafer in response to the control circuitry sensing the short circuit. As a result, if the wafer is under probe test, for example, testing can continue uninterrupted on the other ICs while the short-circuited IC is isolated.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 SOUTH FEDERAL WAY BOISE ID 83716-9632

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beffa, Raymond J Boise, ID 63 1341
Cloud, Eugene H Boise, ID 92 3562
Farnworth, Warren M Nampa, ID 855 33798
Nevill, Leland R Boise, ID 63 1548
Waller, William K Garland, TX 55 804

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