Importance

Loading Importance Indicators...

Abstract

A circuit board assembly having integrated circuit packages vertically arranged three dimensionally is used to increase electronic component density without increasing the size of the circuit board. For a preferred embodiment of the circuit board assembly, the printed circuit board has at least one primary mounting pad array affixed thereto, each pad of the array having first and second portions. Each lead of a first integrated circuit package is conductively bonded to the first portion of a different mounting pad of said primary array. A package carrier having a plurality of carrier leads attached thereto and a secondary mounting pad array on an upper surface thereof, covers the first package. Each lead of the carrier is coupled to a different pad of the secondary array and is also conductively bonded to the second portion of a different mounting pad of the primary array. Each lead of a second integrated circuit package is conductively bonded to a different mounting pad of the secondary mounting pad array. For a preferred embodiment of the invention, the carrier is provided with embedded lead frame elements which form both the leads and the mounting pads of the carrier. The result is a circuit board assembly having lower component costs, lower assembly costs, and a lower profile than that of the first embodiment assembly.

Loading the Abstract Image...

First Claim