Stacked integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 6, 2001
Issued Date -
N/A
app pub date -
Sep 19, 2000
filing date -
Nov 23, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
System modules are described which include a stack of interconnected semiconductor dies. The semiconductor dies are interconnected by micro bump bonding of coaxial lines that extend through the thickness of the various dies. The coaxial lines also are selectively connected to integrated circuits housed within the dies. In one embodiment, a number of memory dies are interconnected in this manner to provide a memory module.
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