Thermosetting resin compositions
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United States of America Patent
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-
Nov 13, 2001
Grant Date -
N/A
app pub date -
Jul 8, 1999
filing date -
Jan 17, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.
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