Method of forming a printed wiring board with compensation scales
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United States of America Patent
Stats
-
Nov 13, 2001
Grant Date -
N/A
app pub date -
Nov 17, 1999
filing date -
Nov 17, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a printed wiring board formed with a film thereon, wherein the printed wiring board has at least a first reference mark and at least a first scale mark separated from the first reference mark, and the film has at least a second reference mark and at least a second scale mark separated from the second reference mark, and the second scale is positioned to overlap the first scale, and the first scale mark has a first scale and the second scale mark has a second scale which is so different from the first scale as to allow measuring a necessary amount of compensation in alignment to the film with reference to the printed wiring board.
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