Component for use in forming printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 13, 2001
Grant Date -
N/A
app pub date -
Aug 18, 2000
filing date -
Aug 18, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.
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