US Patent No: 6,316,838

Number of patents in Portfolio can not be more than 2000

Semiconductor device

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Abstract

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A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI16443

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akashi, Yuji Kasugai, JP 8 575
Harayama, Masahiko Kawasaki, JP 8 379
Hiraoka, Tetsuya Kawasaki, JP 14 575
Okada, Akira Kawasaki, JP 137 1454
Okuda, Hayato Aizuwakamatsu, JP 11 522
Ozawa, Kaname Kawasaki, JP 8 567
Sato, Mitsutaka Kawasaki, JP 56 1748

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (4)
* 6,104,084 Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads 45 1998
* 6,118,184 Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow 143 1998
* 6,100,594 Semiconductor device and method of manufacturing the same 198 1998
* 6,181,002 Semiconductor device having a plurality of semiconductor chips 207 1999
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
* 5,495,398 Stacked multi-chip modules and method of manufacturing 240 1995
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
* 6,118,176 Stacked chip assembly utilizing a lead frame 86 1999
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (6)
* 2003/0205,725 Semiconductor device and its manufacturing method 1 2003
* 2006/0208,038 Method and contact point for establishing an electrical connection 1 2006
9,245,082 High-speed shape-based router 0 2006
* 2011/0018,084 ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF 6 2010
* 2012/0133,038 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE 0 2012
* 2015/0031,149 MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME 0 2014
 
SONY CORPORATION (1)
* 2005/0173,813 Electronic component and fabricating method 2 2005
 
CADENCE DESIGN SYSTEMS, INC. (45)
6,870,255 Integrated circuit wiring architectures to support independent designs 10 2000
* 6,858,939 Integrated circuit diagonal wiring architectures with zag conductors 2 2001
6,915,500 Method and arrangement for layout and manufacture of nonmanhattan semiconductor integrated circuit using simulated Euclidean wiring 11 2001
6,895,567 Method and arrangement for layout of gridless nonManhattan semiconductor integrated circuit designs 26 2001
6,957,410 Method and apparatus for adaptively selecting the wiring model for a design region 5 2001
7,073,150 Hierarchical routing method and apparatus that use diagonal routes 4 2001
7,003,754 Routing method and apparatus that use of diagonal routes 6 2001
7,398,498 Method and apparatus for storing routes for groups of related net configurations 10 2002
7,143,382 Method and apparatus for storing routes 4 2002
7,096,448 Method and apparatus for diagonal routing by using several sets of lines 9 2002
6,931,616 Routing method and apparatus 19 2002
6,915,501 LP method and apparatus for identifying routes 5 2002
6,883,154 LP method and apparatus for identifying route propagations 8 2002
6,738,960 Method and apparatus for producing sub-optimal routes for a net by generating fake configurations 20 2002
* 2003/0101,428 Routing method and apparatus 2 2002
* 2003/0043,827 LP method and apparatus for identifying route propagations 0 2002
* 2003/0023,943 Method and apparatus for producing sub-optimal routes for a net by generating fake configurations 0 2002
7,139,994 Method and apparatus for pre-computing routes 4 2002
* 6,900,540 Simulating diagonal wiring directions using Manhattan directional wires 4 2002
* 6,858,935 Simulating euclidean wiring directions using manhattan and diagonal directional wires 12 2002
7,155,697 Routing method and apparatus 11 2002
6,907,593 Method and apparatus for pre-computing attributes of routes 6 2002
6,877,149 Method and apparatus for pre-computing routes 4 2002
6,745,379 Method and apparatus for identifying propagation for routes with diagonal edges 13 2002
7,013,450 Method and apparatus for routing 8 2002
7,036,105 Integrated circuits with at least one layer that has more than one preferred interconnect direction, and method for manufacturing such IC's 10 2002
6,973,634 IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout 9 2002
6,957,411 Gridless IC layout and method and apparatus for generating such a layout 16 2002
7,480,885 Method and apparatus for routing with independent goals on different layers 24 2002
7,171,635 Method and apparatus for routing 21 2002
7,143,383 Method for layout of gridless non manhattan integrated circuits with tile based router 1 2002
7,080,342 Method and apparatus for computing capacity of a region for non-Manhattan routing 17 2002
7,047,513 Method and apparatus for searching for a three-dimensional global path 10 2002
7,010,771 Method and apparatus for searching for a global path 16 2002
7,003,752 Method and apparatus for routing 13 2002
6,996,789 Method and apparatus for performing an exponential path search 15 2002
6,988,257 Method and apparatus for routing 7 2002
* 2004/0103,387 Method and apparatus for computing capacity of a region for non-manhattan routing 3 2002
* 2004/0098,696 Method and apparatus for routing 0 2002
* 2004/0098,691 Method and apparatus for performing an exponential path search 6 2002
* 2004/0098,697 Method and apparatus for routing with independent goals on different layers 23 2002
8,201,128 Method and apparatus for approximating diagonal lines in placement 1 2006
8,250,514 Localized routing direction 5 2006
8,112,733 Method and apparatus for routing with independent goals on different layers 14 2008
8,341,586 Method and system for routing 4 2009
 
NANYA TECHNOLOGY CORPORATION (1)
* 2011/0084,374 SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME 0 2009
 
MICRON TECHNOLOGY, INC. (3)
* 8,089,142 Methods and apparatus for a stacked-die interposer 2 2002
* 7,615,871 Method and apparatus for attaching microelectronic substrates and support members 0 2006
8,476,117 Methods and apparatus for a stacked-die interposer 0 2012
 
SAMSUNG ELECTRONICS CO., LTD. (7)
* 8,030,747 Stacked package and method of manufacturing the same 0 2008
* 2012/0056,178 MULTI-CHIP PACKAGES 0 2011
8,349,651 Stacked package and method of manufacturing the same 1 2011
* 8,791,580 Integrated circuit packages having redistribution structures 0 2012
* 2013/0168,842 INTEGRATED CIRCUIT PACKAGES HAVING REDISTRIBUTION STRUCTURES 0 2012
* 2013/0093,080 MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME 0 2012
* 9,252,123 Multi-chip package and method of manufacturing the same 0 2014
 
FAIRCHILD SEMICONDUCTOR CORPORATION (2)
* 8,314,499 Flexible and stackable semiconductor die packages having thin patterned conductive layers 1 2008
* 2010/0123,257 Flexible and Stackable Semiconductor Die Packages, Systems Using the Same, and Methods of Making the Same 6 2008
 
AMPHENOL THERMOMETRICS, INC. (1)
* 8,264,074 Device for use as dual-sided sensor package 1 2010
 
DSS TECHNOLOGY MANAGEMENT, INC. (2)
* 7,374,967 Multi-stack chip size packaging method 3 2003
* 2004/0150,098 Multi-stack chip size packaging method 0 2003
 
POWERTECH TECHNOLOGY INC. (1)
* 2011/0304,044 STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD 0 2010
 
BRIDGE SEMICONDUCTOR CORPORATION (1)
* 6,744,126 Multichip semiconductor package device 43 2002
 
RENESAS TECHNOLOGY CORP. (2)
* 6,852,571 Method of manufacturing stacked semiconductor device 0 2003
* 2004/0180,471 Method of manufacturing stacked semiconductor device 1 2003
 
SOCIONEXT INC. (4)
* 6,818,999 Semiconductor device having multiple semiconductor chips in a single package 7 2003
* 2003/0180,988 Semiconductor device and method of manufacturing the same 1 2003
8,404,980 Relay board and semiconductor device having the relay board 0 2010
* 2010/0258,926 RELAY BOARD AND SEMICONDUCTOR DEVICE HAVING THE RELAY BOARD 1 2010
 
STATS CHIPPAC LTD. (26)
7,253,511 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 34 2004
* 2006/0012,018 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 3 2004
7,768,125 Multi-chip package system 10 2006
* 2007/0158,809 Multi-chip package system 12 2006
7,750,482 Integrated circuit package system including zero fillet resin 2 2006
8,704,349 Integrated circuit package system with exposed interconnects 1 2006
7,429,786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides 80 2006
7,429,787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides 40 2006
7,372,141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides 48 2006
* 2006/0244,117 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides 17 2006
* 2006/0220,210 Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides 20 2006
7,582,960 Multiple chip package module including die stacked over encapsulated package 4 2006
7,394,148 Module having stacked chip scale semiconductor packages 32 2006
* 2006/0284,299 Module Having Stacked Chip Scale Semiconductor Packages 10 2006
* 8,203,214 Integrated circuit package in package system with adhesiveless package attach 2 2007
7,692,279 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 4 2007
7,687,313 Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package 6 2008
7,687,315 Stacked integrated circuit package system and method of manufacture therefor 5 2008
7,855,100 Integrated circuit package system with an encapsulant cavity and method of fabrication thereof 5 2008
7,645,634 Method of fabricating module having stacked chip scale semiconductor packages 6 2008
7,652,376 Integrated circuit package system including stacked die 4 2008
7,829,382 Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 2 2010
* 2010/0136,744 METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE 1 2010
8,021,924 Encapsulant cavity integrated circuit package system and method of fabrication thereof 4 2010
8,309,397 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof 2 2011
* 8,810,019 Integrated circuit package system with stacked die 0 2012
 
STATS CHIPPAC, INC. (26)
* 6,661,083 Plastic semiconductor package 39 2002
7,205,647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages 21 2003
7,064,426 Semiconductor multi-package module having wire bond interconnect between stacked packages 66 2003
7,053,476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 53 2003
6,972,481 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 72 2003
* 2004/0065,963 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield 22 2003
* 2004/0063,246 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 64 2003
* 2004/0063,242 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages 43 2003
* 2004/0056,277 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 37 2003
8,970,049 Multiple chip package module having inverted package stacked over die 0 2004
* 2005/0133,916 Multiple chip package module having inverted package stacked over die 75 2004
8,552,551 Adhesive/spacer island structure for stacking over wire bonded die 0 2005
* 2005/0269,676 Adhesive/spacer island structure for stacking over wire bonded die 4 2005
7,682,873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 0 2006
7,279,361 Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages 10 2006
* 2006/0172,463 Semiconductor multi-package module having wire bond interconnect between stacked packages 3 2006
* 2006/0170,091 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 16 2006
8,623,704 Adhesive/spacer island structure for multiple die package 0 2006
* 2007/0015,314 Adhesive/Spacer Island Structure for Multiple Die Package 1 2006
8,030,134 Stacked semiconductor package having adhesive/spacer structure and insulation 2 2006
7,351,610 Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate 3 2007
8,143,100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages 2 2007
7,749,807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies 4 2007
* 2009/0027,863 Method for making a semiconductor multipackage module including a processor and memory package assemblies 10 2007
7,935,572 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages 1 2010
* 2010/0200,966 SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-UP FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES 15 2010
 
AMKOR TECHNOLOGY, INC. (162)
7,102,208 Leadframe and semiconductor package with improved solder joint strength 5 2000
* 6,642,610 Wire bonding method and semiconductor package manufactured using the same 31 2000
* 2002/0125,556 Stacking structure of semiconductor chips and semiconductor package using it 24 2001
* 6,927,478 Reduced size semiconductor package with stacked dies 117 2002
* 6,982,485 Stacking structure for semiconductor chips and a semiconductor package using it 32 2002
6,818,973 Exposed lead QFP package fabricated through the use of a partial saw process 104 2002
6,919,620 Compact flash memory card with clamshell leadframe 1 2002
6,798,047 Pre-molded leadframe 7 2002
6,777,789 Mounting for a package containing a chip 10 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 18 2003
6,794,740 Leadframe package for semiconductor devices 11 2003
6,803,254 Wire bonding method for a semiconductor package 6 2003
* 2003/0199,118 Wire bonding method for a semiconductor package 0 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 8 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 124 2003
7,008,825 Leadframe strip having enhanced testability 46 2003
6,876,068 Semiconductor package with increased number of input and output pins 64 2003
7,183,630 Lead frame with plated end leads 39 2003
6,897,550 Fully-molded leadframe stand-off feature 5 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,032 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 13 2003
6,873,041 Power semiconductor package with strap 19 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 4 2003
7,245,007 Exposed lead interposer leadframe package 67 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 6 2003
6,921,967 Reinforced die pad support structure 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 9 2003
6,846,704 Semiconductor package and method for manufacturing the same 15 2003
6,967,395 Mounting for a package containing a chip 16 2003
6,893,900 Method of making an integrated circuit package 5 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,144,517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 6 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 14 2003
7,115,445 Semiconductor package having reduced thickness 2 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 16 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 8 2004
7,170,150 Lead frame for semiconductor package 4 2004
6,844,615 Leadframe package for semiconductor devices 16 2004
7,005,326 Method of making an integrated circuit package 9 2004
7,190,062 Embedded leadframe semiconductor package 42 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 68 2004
7,598,598 Offset etched corner leads for semiconductor package 2 2004
7,202,554 Semiconductor package and its manufacturing method 19 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 19 2004
7,217,991 Fan-in leadframe semiconductor package 13 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 64 2004
7,001,799 Method of making a leadframe for semiconductor devices 7 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 7 2004
7,214,326 Increased capacity leadframe and semiconductor package using the same 5 2005
7,247,523 Two-sided wafer escape package 36 2005
6,995,459 Semiconductor package with increased number of input and output pins 76 2005
7,192,807 Wafer level package and fabrication method 46 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 14 2005
7,485,490 Method of forming a stacked semiconductor package 8 2005
7,507,603 Etch singulated semiconductor package 17 2005
7,361,533 Stacked embedded leadframe 48 2005
7,572,681 Embedded electronic component package 46 2005
7,112,474 Method of making an integrated circuit package 4 2005
7,675,180 Stacked electronic component package having film-on-wire spacer 8 2006
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 2 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 2 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 67 2006
7,633,144 Semiconductor package 7 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 8 2006
7,321,162 Semiconductor package having reduced thickness 3 2006
7,332,375 Method of making an integrated circuit package 4 2006
7,521,294 Lead frame for semiconductor package 6 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 41 2006
7,687,893 Semiconductor package having leadframe with exposed anchor pads 10 2006
7,829,990 Stackable semiconductor package including laminate interposer 4 2007
7,982,297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 6 2007
7,420,272 Two-sided wafer escape package 36 2007
7,723,210 Direct-write wafer level chip scale package 21 2007
7,977,774 Fusion quad flat semiconductor package 9 2007
7,687,899 Dual laminate package structure with embedded elements 11 2007
7,777,351 Thin stacked interposer package 135 2007
8,089,159 Semiconductor package with increased I/O density and method of making the same 5 2007
7,847,386 Reduced size stacked semiconductor package and method of making the same 1 2007
7,560,804 Integrated circuit package and method of making the same 7 2008
7,956,453 Semiconductor package with patterning layer and method of making same 3 2008
7,723,852 Stacked semiconductor package and method of making same 18 2008
8,067,821 Flat semiconductor package with half package molding 8 2008
7,768,135 Semiconductor package with fast power-up cycle and method of making same 11 2008
7,808,084 Semiconductor package with half-etched locking features 9 2008
8,125,064 Increased I/O semiconductor package and method of making same 3 2008
8,184,453 Increased capacity semiconductor package 8 2008
7,692,286 Two-sided fan-out wafer escape package 40 2008
7,847,392 Semiconductor device including leadframe with increased I/O 10 2008
7,989,933 Increased I/O leadframe and semiconductor device including same 7 2008
8,008,758 Semiconductor device with increased I/O leadframe 6 2008
8,089,145 Semiconductor device including increased capacity leadframe 1 2008
8,072,050 Semiconductor device with increased I/O leadframe including passive device 1 2008
7,875,963 Semiconductor device including leadframe having power bars and increased I/O 12 2008
7,982,298 Package in package semiconductor device 4 2008
8,487,420 Package in package semiconductor device with film over wire 0 2008
7,863,723 Adhesive on wire stacked semiconductor package 7 2008
8,680,656 Leadframe structure for concentrated photovoltaic receiver package 0 2009
8,058,715 Package in package device for RF transceiver module 3 2009
7,732,899 Etch singulated semiconductor package 1 2009
8,026,589 Reduced profile stackable semiconductor package 17 2009
7,960,818 Conformal shield on punch QFN semiconductor package 1 2009
7,928,542 Lead frame for semiconductor package 2 2009
8,575,742 Semiconductor device with increased I/O leadframe including power bars 4 2009
7,977,163 Embedded electronic component package fabrication method 16 2009
8,796,561 Fan out build up substrate stackable package and method 3 2009
8,129,849 Method of making semiconductor package with adhering portion 0 2009
8,937,381 Thin stackable package and method 0 2009
8,072,083 Stacked electronic component package having film-on-wire spacer 2 2010
8,089,141 Semiconductor package having leadframe with exposed anchor pads 1 2010
7,872,343 Dual laminate package structure with embedded elements 7 2010
8,188,584 Direct-write wafer level chip scale package 19 2010
7,932,595 Electronic component package comprising fan-out traces 18 2010
8,324,511 Through via nub reveal method and structure 5 2010
7,906,855 Stacked semiconductor package and method of making same 3 2010
8,294,276 Semiconductor device and fabricating method thereof 1 2010
8,084,868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8,319,338 Thin stacked interposer package 19 2010
8,440,554 Through via connected backside embedded circuit features structure and method 2 2010
8,487,445 Semiconductor device having through electrodes protruding from dielectric layer 1 2010
8,299,602 Semiconductor device including leadframe with increased I/O 0 2010
8,143,727 Adhesive on wire stacked semiconductor package 3 2010
8,791,501 Integrated passive device structure and method 0 2010
8,674,485 Semiconductor device including leadframe with downsets 1 2010
8,283,767 Dual laminate package structure with embedded elements 3 2010
8,188,579 Semiconductor device including leadframe having power bars and increased I/O 8 2010
8,390,130 Through via recessed reveal structure and method 5 2011
8,318,287 Integrated circuit package and method of making the same 6 2011
8,648,450 Semiconductor device including leadframe with a combination of leads and lands 0 2011
8,102,037 Leadframe for semiconductor package 0 2011
8,119,455 Wafer level package fabrication method 9 2011
8,729,710 Semiconductor package with patterning layer and method of making same 0 2011
8,729,682 Conformal shield on punch QFN semiconductor package 0 2011
8,441,110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 3 2011
8,304,866 Fusion quad flat semiconductor package 1 2011
8,432,023 Increased I/O leadframe and semiconductor device including same 1 2011
8,823,152 Semiconductor device with increased I/O leadframe 0 2011
8,558,365 Package in package device for RF transceiver module 0 2011
8,552,548 Conductive pad on protruding through electrode semiconductor device 0 2011
8,298,866 Wafer level package and fabrication method 5 2012
9,129,943 Embedded component package and fabrication method 0 2012
9,048,298 Backside warpage control structure and fabrication method 0 2012
8,501,543 Direct-write wafer level chip scale package 3 2012
8,486,764 Wafer level package and fabrication method 3 2012
8,853,836 Integrated circuit package and method of making the same 1 2012
9,082,833 Through via recessed reveal structure and method 0 2013
9,159,672 Through via connected backside embedded circuit features structure and method 0 2013
8,691,632 Wafer level package and fabrication method 2 2013
8,900,995 Semiconductor device and manufacturing method thereof 0 2013
8,981,572 Conductive pad on protruding through electrode semiconductor device 0 2013
8,710,649 Wafer level package and fabrication method 2 2013
8,963,301 Integrated circuit package and method of making the same 0 2013
8,952,522 Wafer level package and fabrication method 0 2014
9,184,118 Micro lead frame structure having reinforcing portions and method 0 2014
9,184,148 Semiconductor package and method therefor 0 2014
9,054,117 Wafer level package and fabrication method 0 2014
9,224,676 Integrated circuit package and method of making the same 0 2015
 
RENESAS ELECTRONICS CORPORATION (2)
* 6,611,063 Resin-encapsulated semiconductor device 45 2000
* 6,433,421 Semiconductor device 29 2001
 
BANK OF AMERICA, N.A. (1)
* 2004/0150,086 Semiconductor package having reduced thickness 0 2004
 
SHINKAWA LTD. (1)
7,821,140 Semiconductor device and wire bonding method 6 2010
 
KABUSHIKI KAISHA TOSHIBA (2)
* 7,755,175 Multi-stack chip package with wired bonded chips 5 2006
* 8,115,290 Storage medium and semiconductor package 0 2009
 
FUJITSU SEMICONDUCTOR LIMITED (1)
* 6,798,031 Semiconductor device and method for making the same 19 2002
 
TESSERA, INC. (19)
* 7,605,479 Stacked chip assembly with encapsulant layer 1 2002
8,525,314 Stacked packaging improvements 12 2005
9,159,708 Stackable molded microelectronic packages with area array unit connectors 0 2010
8,482,111 Stackable molded microelectronic packages 15 2010
8,531,020 Stacked packaging improvements 0 2010
8,728,865 Microelectronic packages and methods therefor 14 2011
8,637,991 Microelectronic package with terminals on dielectric mass 0 2011
8,623,706 Microelectronic package with terminals on dielectric mass 1 2011
8,618,659 Package-on-package assembly with wire bonds to encapsulation surface 2 2012
8,659,164 Microelectronic package with terminals on dielectric mass 16 2012
9,093,435 Package-on-package assembly with wire bonds to encapsulation surface 0 2013
8,969,133 Package-on-package assembly with wire bonds to encapsulation surface 0 2013
8,907,466 Stackable molded microelectronic packages 0 2013
8,927,337 Stacked packaging improvements 7 2013
8,957,527 Microelectronic package with terminals on dielectric mass 0 2014
9,218,988 Microelectronic packages and methods therefor 0 2014
9,123,664 Stackable molded microelectronic packages 0 2014
9,224,717 Package-on-package assembly with wire bonds to encapsulation surface 0 2014
9,153,562 Stacked packaging improvements 0 2014
 
HYNIX SEMICONDUCTOR INC. (2)
* 7,834,463 Stack package having pattern die redistribution 2 2006
* 2008/0001,304 Stack package having pattern die redistribution 0 2006
 
INVENSAS CORPORATION (15)
9,105,483 Package-on-package assembly with wire bond vias 0 2012
8,836,136 Package-on-package assembly with wire bond vias 1 2012
8,404,520 Package-on-package assembly with wire bond vias 3 2012
8,835,228 Substrate-less stackable package with wire-bond interconnect 1 2012
8,975,738 Structure for microelectronic packaging with terminals on dielectric mass 0 2012
8,878,353 Structure for microelectronic packaging with bond elements to encapsulation surface 6 2012
9,041,227 Package-on-package assembly with wire bond vias 0 2013
9,034,696 Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation 0 2013
9,023,691 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation 0 2013
9,252,122 Package-on-package assembly with wire bond vias 0 2013
9,087,815 Off substrate kinking of bond wire 0 2013
9,214,454 Batch process fabrication of package-on-package microelectronic assemblies 0 2014
8,883,563 Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation 4 2014
9,082,753 Severing bond wire by kinking and twisting 0 2014
9,095,074 Structure for microelectronic packaging with bond elements to encapsulation surface 0 2014
 
LAPIS SEMICONDUCTOR CO., LTD. (5)
6,580,164 Semiconductor device and method of manufacturing same 13 2000
6,777,801 Semiconductor device and method of manufacturing same 2 2003
7,414,320 Semiconductor device and method of manufacturing same 5 2005
* 2005/0181,539 Semiconductor device and method of manufacturing same 3 2005
* 7,705,469 Lead frame, semiconductor device using same and manufacturing method thereof 3 2008
 
OKI SEMICONDUCTOR CO., LTD. (4)
* 6,836,010 Semiconductor device include relay chip connecting semiconductor chip pads to external pads 7 2003
* 2004/0017,003 Semiconductor device and method of producing the same 0 2003
6,905,913 Semiconductor device and method of manufacturing same 4 2004
* 2004/0262,775 Semiconductor device and method of manufacturing same 0 2004
 
SHARP KABUSHIKI KAISHA (1)
RE41826 Semiconductor device 4 2007
 
TESSERA ADVANCED TECHNOLOGIES, INC. (1)
* 6,777,796 Stacked semiconductor chips on a wiring board 3 2002
 
CHIPPAC, INC. (2)
7,364,946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package 9 2007
7,358,115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides 4 2007
 
FUJITSU LIMITED (2)
* 6,882,045 Multi-chip module and method for forming and method for deplating defective capacitors 42 2001
* 2002/0155,661 Multi-chip module and method for forming and method for deplating defective capacitors 12 2001
 
CHIPMOS TECHNOLOGIES INC. (1)
* 2009/0146,278 Chip-stacked package structure with asymmetrical leadframe 1 2007
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
* 7,288,841 Laminated semiconductor package 18 2006
 
Pulsic Limited (21)
7,784,010 Automatic routing system with variable width interconnect 20 2004
7,131,096 Method of automatically routing nets according to current density rules 27 2004
7,257,797 Method of automatic shape-based routing of interconnects in spines for integrated circuit design 36 2005
7,363,607 Method of automatically routing nets according to parasitic constraint rules 19 2005
7,530,040 Automatically routing nets according to current density rules 12 2006
7,373,628 Method of automatically routing nets using a Steiner tree 9 2006
7,603,644 Integrated circuit routing and compaction 9 2006
7,823,113 Automatic integrated circuit routing using spines 11 2006
8,095,903 Automatically routing nets with variable spacing 11 2006
8,099,700 Automatic integrated circuit routing using spines 11 2007
7,802,208 Design automation using spine routing 19 2007
8,171,447 Automatically routing nets according to current density rules 2 2009
7,984,411 Integrated circuit routing and compaction 0 2009
8,458,636 Filling vacant areas of an integrated circuit design 0 2010
8,479,139 Automatic routing system with variable width interconnect 6 2010
8,332,805 Automatically routing nets according to parasitic constraint rules 4 2011
8,332,799 Integrated circuit routing with compaction 0 2011
8,949,760 Automatically routing nets with variable spacing 0 2012
8,479,141 Automation using spine routing 6 2012
8,751,996 Automatically routing nets according to parasitic constraint rules 3 2012
8,707,239 Integrated circuit routing with compaction 2 2012
 
SiTime Corporation (3)
* 8,669,664 Stacked die package for MEMS resonator system 0 2012
* 2013/0075,853 Stacked Die Package for MEMS Resonator System 1 2012
8,941,247 Stacked die package for MEMS resonator system 0 2014
 
NATIONAL SEMICONDUCTOR CORPORATION (27)
* 6,707,140 Arrayable, scaleable, and stackable molded package configuration 41 2000
6,624,507 Miniature semiconductor package for opto-electronic devices 32 2001
6,642,613 Techniques for joining an opto-electronic module to a semiconductor package 6 2001
7,023,705 Ceramic optical sub-assembly for optoelectronic modules 0 2002
6,973,225 Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package 1 2002
6,916,121 Optical sub-assembly for optoelectronic modules 5 2002
* 2003/0026,556 Optical sub-assembly for optoelectronic modules 0 2002
6,765,275 Two-layer electrical substrate for optical devices 0 2002
6,767,140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology 5 2003
* 2003/0165,303 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC ( low-temperature co-fired ceramic ) technology 0 2003
6,858,468 Techniques for joining an opto-electronic module to a semiconductor package 2 2003
7,156,562 Opto-electronic module form factor having adjustable optical plane height 22 2003
6,985,668 Multi-purpose optical light pipe 0 2003
* 2005/0013,560 Opto-electronic module form factor having adjustable optical plane height 3 2003
6,838,317 Techniques for joining an opto-electronic module to a semiconductor package 0 2003
* 2004/0048,417 Techniques for joining an opto-electronic module to a semiconductor package 0 2003
7,086,786 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology 0 2004
* 2004/0213,525 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology 0 2004
7,432,575 Two-layer electrical substrate for optical devices 0 2004
* 2004/0216,918 Two-layer electrical substrate for optical devices 0 2004
7,247,942 Techniques for joining an opto-electronic module to a semiconductor package 3 2004
* 2005/0100,294 Techniques for joining an opto-electronic module to a semiconductor package 20 2004
7,199,440 Techniques for joining an opto-electronic module to a semiconductor package 0 2004
* 2005/0117,835 Techniques for joining an opto-electronic module to a semiconductor package 7 2004
7,086,788 Optical sub-assembly for opto-electronic modules 3 2005
7,269,027 Ceramic optical sub-assembly for optoelectronic modules 0 2006
* 2006/0140,534 Ceramic optical sub-assembly for optoelectronic modules 0 2006
 
ROBERT BOSCH GMBH (2)
* 7,083,077 Method and contact point for establishing an electrical connection 2 2002
7,906,858 Contact securing element for bonding a contact wire and for establishing an electrical connection 0 2006
 
SIMPLEX SOLUTIONS, INC. (3)
6,795,958 Method and apparatus for generating routes for groups of related node configurations 8 2002
6,952,815 Probabilistic routing method and apparatus 9 2002
* 2003/0088,845 Probabilistic routing method and apparatus 1 2002
 
MITSUBISHI DENKI KABUSHIKI KAISHA (3)
* 6,633,078 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal 46 2001
6,905,911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal 6 2003
* 2004/0021,212 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal 7 2003
 
TEXAS INSTRUMENTS INCORPORATED (4)
* 6,583,483 Semiconductor device and its manufacturing method 5 2001
* 6,780,749 Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges 43 2003
7,573,137 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices 1 2006
* 2007/0228,543 Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices 7 2006
 
TAMIRAS PER PTE. LTD., LLC (7)
7,576,995 Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area 6 2005
7,508,058 Stacked integrated circuit module 0 2006
7,608,920 Memory card and method for devising 2 2006
7,508,069 Managed memory component 1 2006
7,304,382 Managed memory component 1 2006
7,605,454 Memory card and method for devising 1 2007
7,468,553 Stackable micropackages and stacked modules 3 2007
 
UTAC HONG KONG LIMITED (1)
6,790,710 Method of manufacturing an integrated circuit package 26 2002
 
SANDISK TECHNOLOGIES INC. (1)
* 2009/0321,501 METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE 6 2008
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 7,250,686 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded 0 2006
* Cited By Examiner