Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6316838
SERIAL NO

09531231

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Abstract

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A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJITSU LIMITEDKAWASAKI17740

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akashi, Yuji Kasugai, JP 8 616
Harayama, Masahiko Kawasaki, JP 8 424
Hiraoka, Tetsuya Kawasaki, JP 14 632
Okada, Akira Kawasaki, JP 145 1648
Okuda, Hayato Aizuwakamatsu, JP 11 558
Ozawa, Kaname Kawasaki, JP 9 604
Sato, Mitsutaka Kawasaki, JP 56 1897

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (4)
* 6104084 Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads 45 1998
* 6118184 Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow 148 1998
* 6100594 Semiconductor device and method of manufacturing the same 206 1998
* 6181002 Semiconductor device having a plurality of semiconductor chips 216 1999
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
* 5495398 Stacked multi-chip modules and method of manufacturing 246 1995
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
* 6118176 Stacked chip assembly utilizing a lead frame 86 1999
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (4)
* 2003/0205,725 Semiconductor device and its manufacturing method 1 2003
* 2006/0208,038 Method and contact point for establishing an electrical connection 1 2006
* 2015/0031,149 MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME 1 2014
9659848 Stiffened wires for offset BVA 0 2016
 
SONY CORPORATION (1)
* 2005/0173,813 Electronic component and fabricating method 3 2005
 
CADENCE DESIGN SYSTEMS, INC. (46)
6870255 Integrated circuit wiring architectures to support independent designs 10 2000
* 6858939 Integrated circuit diagonal wiring architectures with zag conductors 2 2001
6915500 Method and arrangement for layout and manufacture of nonmanhattan semiconductor integrated circuit using simulated Euclidean wiring 11 2001
6895567 Method and arrangement for layout of gridless nonManhattan semiconductor integrated circuit designs 26 2001
6957410 Method and apparatus for adaptively selecting the wiring model for a design region 5 2001
7073150 Hierarchical routing method and apparatus that use diagonal routes 4 2001
7003754 Routing method and apparatus that use of diagonal routes 6 2001
7398498 Method and apparatus for storing routes for groups of related net configurations 12 2002
7143382 Method and apparatus for storing routes 4 2002
7096448 Method and apparatus for diagonal routing by using several sets of lines 9 2002
6931616 Routing method and apparatus 19 2002
6915501 LP method and apparatus for identifying routes 5 2002
6883154 LP method and apparatus for identifying route propagations 8 2002
6738960 Method and apparatus for producing sub-optimal routes for a net by generating fake configurations 20 2002
* 2003/0101,428 Routing method and apparatus 2 2002
* 2003/0043,827 LP method and apparatus for identifying route propagations 0 2002
* 2003/0023,943 Method and apparatus for producing sub-optimal routes for a net by generating fake configurations 1 2002
7139994 Method and apparatus for pre-computing routes 4 2002
* 6900540 Simulating diagonal wiring directions using Manhattan directional wires 4 2002
* 6858935 Simulating euclidean wiring directions using manhattan and diagonal directional wires 12 2002
7155697 Routing method and apparatus 11 2002
6907593 Method and apparatus for pre-computing attributes of routes 6 2002
6877149 Method and apparatus for pre-computing routes 5 2002
6745379 Method and apparatus for identifying propagation for routes with diagonal edges 13 2002
7013450 Method and apparatus for routing 8 2002
7036105 Integrated circuits with at least one layer that has more than one preferred interconnect direction, and method for manufacturing such IC's 10 2002
6973634 IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout 9 2002
6957411 Gridless IC layout and method and apparatus for generating such a layout 17 2002
7480885 Method and apparatus for routing with independent goals on different layers 24 2002
7171635 Method and apparatus for routing 21 2002
7143383 Method for layout of gridless non manhattan integrated circuits with tile based router 2 2002
7080342 Method and apparatus for computing capacity of a region for non-Manhattan routing 17 2002
7047513 Method and apparatus for searching for a three-dimensional global path 10 2002
7010771 Method and apparatus for searching for a global path 16 2002
7003752 Method and apparatus for routing 14 2002
6996789 Method and apparatus for performing an exponential path search 16 2002
6988257 Method and apparatus for routing 7 2002
* 2004/0103,387 Method and apparatus for computing capacity of a region for non-manhattan routing 3 2002
* 2004/0098,696 Method and apparatus for routing 0 2002
* 2004/0098,691 Method and apparatus for performing an exponential path search 8 2002
* 2004/0098,697 Method and apparatus for routing with independent goals on different layers 24 2002
* 2004/0098,694 Method and apparatus for routing 1 2002
8201128 Method and apparatus for approximating diagonal lines in placement 1 2006
8250514 Localized routing direction 5 2006
8112733 Method and apparatus for routing with independent goals on different layers 15 2008
8341586 Method and system for routing 5 2009
 
NANYA TECHNOLOGY CORPORATION (1)
* 2011/0084,374 SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME 3 2009
 
MICRON TECHNOLOGY, INC. (3)
* 8089142 Methods and apparatus for a stacked-die interposer 5 2002
* 7615871 Method and apparatus for attaching microelectronic substrates and support members 0 2006
8476117 Methods and apparatus for a stacked-die interposer 2 2012
 
UNISEMICON CO., LTD. (1)
* 2008/0203,552 Stacked Package and Method of Fabricating the Same 4 2005
 
SAMSUNG ELECTRONICS CO., LTD. (7)
* 8030747 Stacked package and method of manufacturing the same 2 2008
* 2012/0056,178 MULTI-CHIP PACKAGES 1 2011
8349651 Stacked package and method of manufacturing the same 1 2011
* 8791580 Integrated circuit packages having redistribution structures 0 2012
* 2013/0168,842 INTEGRATED CIRCUIT PACKAGES HAVING REDISTRIBUTION STRUCTURES 1 2012
* 2013/0093,080 MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME 0 2012
* 9252123 Multi-chip package and method of manufacturing the same 0 2014
 
FAIRCHILD SEMICONDUCTOR CORPORATION (2)
* 8314499 Flexible and stackable semiconductor die packages having thin patterned conductive layers 1 2008
* 2010/0123,257 Flexible and Stackable Semiconductor Die Packages, Systems Using the Same, and Methods of Making the Same 7 2008
 
AMPHENOL THERMOMETRICS, INC. (1)
* 8264074 Device for use as dual-sided sensor package 2 2010
 
DSS TECHNOLOGY MANAGEMENT, INC. (2)
* 7374967 Multi-stack chip size packaging method 3 2003
* 2004/0150,098 Multi-stack chip size packaging method 0 2003
 
UTAC HEADQUARTERS PTE. LTD. (1)
6790710 Method of manufacturing an integrated circuit package 27 2002
 
POWERTECH TECHNOLOGY INC. (1)
* 2011/0304,044 STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD 0 2010
 
BRIDGE SEMICONDUCTOR CORPORATION (1)
* 6744126 Multichip semiconductor package device 57 2002
 
RENESAS TECHNOLOGY CORP. (2)
* 6852571 Method of manufacturing stacked semiconductor device 0 2003
* 2004/0180,471 Method of manufacturing stacked semiconductor device 1 2003
 
TAMIRAS PER PTE. LTD., LLC (7)
7576995 Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area 6 2005
7508058 Stacked integrated circuit module 0 2006
7608920 Memory card and method for devising 2 2006
7508069 Managed memory component 1 2006
7304382 Managed memory component 1 2006
7605454 Memory card and method for devising 1 2007
7468553 Stackable micropackages and stacked modules 3 2007
 
SOCIONEXT INC. (4)
* 6818999 Semiconductor device having multiple semiconductor chips in a single package 8 2003
* 2003/0180,988 Semiconductor device and method of manufacturing the same 5 2003
8404980 Relay board and semiconductor device having the relay board 0 2010
* 2010/0258,926 RELAY BOARD AND SEMICONDUCTOR DEVICE HAVING THE RELAY BOARD 1 2010
 
STATS CHIPPAC PTE. LTE. (56)
* 6661083 Plastic semiconductor package 40 2002
7205647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages 23 2003
7064426 Semiconductor multi-package module having wire bond interconnect between stacked packages 70 2003
7053476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 54 2003
6972481 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 75 2003
* 2004/0065,963 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield 32 2003
* 2004/0063,246 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 81 2003
* 2004/0063,242 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages 55 2003
* 2004/0061,212 Semiconductor multi-package module having wire bond interconnect between stacked packages 44 2003
* 2004/0056,277 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 47 2003
8970049 Multiple chip package module having inverted package stacked over die 0 2004
* 2005/0133,916 Multiple chip package module having inverted package stacked over die 96 2004
7253511 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 35 2004
* 2006/0012,018 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 4 2004
8552551 Adhesive/spacer island structure for stacking over wire bonded die 1 2005
* 2005/0269,676 Adhesive/spacer island structure for stacking over wire bonded die 5 2005
7768125 Multi-chip package system 11 2006
* 2007/0158,809 Multi-chip package system 13 2006
7750482 Integrated circuit package system including zero fillet resin 2 2006
8704349 Integrated circuit package system with exposed interconnects 1 2006
7682873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 2 2006
7279361 Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages 12 2006
* 2006/0172,463 Semiconductor multi-package module having wire bond interconnect between stacked packages 3 2006
* 2006/0170,091 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 17 2006
7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides 92 2006
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides 47 2006
7372141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides 51 2006
* 2006/0244,117 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides 22 2006
* 2006/0220,210 Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides 29 2006
7582960 Multiple chip package module including die stacked over encapsulated package 6 2006
7394148 Module having stacked chip scale semiconductor packages 41 2006
* 2006/0284,299 Module Having Stacked Chip Scale Semiconductor Packages 14 2006
8623704 Adhesive/spacer island structure for multiple die package 0 2006
* 2007/0015,314 Adhesive/Spacer Island Structure for Multiple Die Package 1 2006
8030134 Stacked semiconductor package having adhesive/spacer structure and insulation 2 2006
7351610 Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate 3 2007
7364946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package 10 2007
* 8203214 Integrated circuit package in package system with adhesiveless package attach 4 2007
7692279 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 4 2007
8143100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages 3 2007
7749807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies 6 2007
* 2009/0027,863 Method for making a semiconductor multipackage module including a processor and memory package assemblies 12 2007
7687313 Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package 7 2008
7687315 Stacked integrated circuit package system and method of manufacture therefor 5 2008
7855100 Integrated circuit package system with an encapsulant cavity and method of fabrication thereof 7 2008
7645634 Method of fabricating module having stacked chip scale semiconductor packages 8 2008
* 2008/0220,563 MODULE HAVING STACKED CHIP SCALE SEMICONDUCTOR PACKAGES 14 2008
7652376 Integrated circuit package system including stacked die 4 2008
7935572 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages 1 2010
* 2010/0200,966 SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING PACKAGE STACKED OVER DIE-UP FLIP CHIP BALL GRID ARRAY PACKAGE AND HAVING WIRE BOND INTERCONNECT BETWEEN STACKED PACKAGES 16 2010
8021924 Encapsulant cavity integrated circuit package system and method of fabrication thereof 5 2010
* 2011/0018,084 ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF 6 2010
8309397 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof 3 2011
* 8810019 Integrated circuit package system with stacked die 0 2012
* 2012/0133,038 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE 0 2012
* 9589910 Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die 0 2013
 
STATS CHIPPAC LTD. (2)
7829382 Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 2 2010
* 2010/0136,744 METHOD FOR MAKING SEMICONDUCTOR MULTIPACKAGE MODULE INCLUDING DIE AND INVERTED LAND GRID ARRAY PACKAGE STACKED OVER BALL GRID ARRAY PACKAGE 1 2010
 
AMKOR TECHNOLOGY, INC. (169)
7102208 Leadframe and semiconductor package with improved solder joint strength 5 2000
* 6642610 Wire bonding method and semiconductor package manufactured using the same 33 2000
* 2002/0125,556 Stacking structure of semiconductor chips and semiconductor package using it 25 2001
* 6927478 Reduced size semiconductor package with stacked dies 139 2002
* 6982485 Stacking structure for semiconductor chips and a semiconductor package using it 48 2002
6818973 Exposed lead QFP package fabricated through the use of a partial saw process 111 2002
6919620 Compact flash memory card with clamshell leadframe 2 2002
6798047 Pre-molded leadframe 7 2002
6777789 Mounting for a package containing a chip 11 2003
6965159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 5 2003
6750545 Semiconductor package capable of die stacking 18 2003
6794740 Leadframe package for semiconductor devices 13 2003
6803254 Wire bonding method for a semiconductor package 6 2003
* 2003/0199,118 Wire bonding method for a semiconductor package 0 2003
7095103 Leadframe based memory card 0 2003
6879034 Semiconductor package including low temperature co-fired ceramic substrate 9 2003
7045396 Stackable semiconductor package and method for manufacturing same 132 2003
7008825 Leadframe strip having enhanced testability 51 2003
6876068 Semiconductor package with increased number of input and output pins 70 2003
7183630 Lead frame with plated end leads 45 2003
6897550 Fully-molded leadframe stand-off feature 5 2003
7485952 Drop resistant bumpers for fully molded memory cards 0 2003
6873032 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 16 2003
6873041 Power semiconductor package with strap 20 2003
7071541 Plastic integrated circuit package and method and leadframe for making the package 4 2003
7245007 Exposed lead interposer leadframe package 75 2003
7057280 Leadframe having lead locks to secure leads to encapsulant 6 2003
6921967 Reinforced die pad support structure 4 2003
6998702 Front edge chamfer feature for fully-molded memory cards 12 2003
6846704 Semiconductor package and method for manufacturing the same 15 2003
6967395 Mounting for a package containing a chip 19 2003
6893900 Method of making an integrated circuit package 5 2003
7138707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7144517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
7211879 Semiconductor package with chamfered corners and method of manufacturing the same 6 2003
6965157 Semiconductor package with exposed die pad and body-locking leadframe 16 2003
7115445 Semiconductor package having reduced thickness 2 2004
7057268 Cavity case with clip/plug for use on multi-media card 20 2004
7091594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 8 2004
7170150 Lead frame for semiconductor package 4 2004
6844615 Leadframe package for semiconductor devices 17 2004
7005326 Method of making an integrated circuit package 9 2004
7190062 Embedded leadframe semiconductor package 47 2004
7211471 Exposed lead QFP package fabricated through the use of a partial saw process 75 2004
7598598 Offset etched corner leads for semiconductor package 2 2004
7202554 Semiconductor package and its manufacturing method 20 2004
7045882 Semiconductor package including flip chip 7 2004
6953988 Semiconductor package 20 2004
7217991 Fan-in leadframe semiconductor package 15 2004
7253503 Integrated circuit device packages and substrates for making the packages 70 2004
7001799 Method of making a leadframe for semiconductor devices 7 2004
7064009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7030474 Plastic integrated circuit package and method and leadframe for making the package 7 2004
7214326 Increased capacity leadframe and semiconductor package using the same 5 2005
7247523 Two-sided wafer escape package 45 2005
6995459 Semiconductor package with increased number of input and output pins 84 2005
7192807 Wafer level package and fabrication method 60 2005
7045883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 16 2005
7485490 Method of forming a stacked semiconductor package 8 2005
7507603 Etch singulated semiconductor package 18 2005
7361533 Stacked embedded leadframe 58 2005
7572681 Embedded electronic component package 56 2005
7112474 Method of making an integrated circuit package 4 2005
7675180 Stacked electronic component package having film-on-wire spacer 10 2006
7564122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 2 2006
8410585 Leadframe and semiconductor package made using the leadframe 2 2006
7535085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7902660 Substrate for semiconductor device and manufacturing method thereof 82 2006
7633144 Semiconductor package 7 2006
7968998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 12 2006
7321162 Semiconductor package having reduced thickness 4 2006
7332375 Method of making an integrated circuit package 4 2006
7521294 Lead frame for semiconductor package 7 2006
7714431 Electronic component package comprising fan-out and fan-in traces 48 2006
7687893 Semiconductor package having leadframe with exposed anchor pads 13 2006
7829990 Stackable semiconductor package including laminate interposer 5 2007
7982297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 8 2007
7420272 Two-sided wafer escape package 44 2007
7723210 Direct-write wafer level chip scale package 24 2007
7977774 Fusion quad flat semiconductor package 11 2007
7687899 Dual laminate package structure with embedded elements 15 2007
7777351 Thin stacked interposer package 179 2007
8089159 Semiconductor package with increased I/O density and method of making the same 7 2007
7847386 Reduced size stacked semiconductor package and method of making the same 1 2007
7560804 Integrated circuit package and method of making the same 7 2008
7956453 Semiconductor package with patterning layer and method of making same 5 2008
7723852 Stacked semiconductor package and method of making same 18 2008
8067821 Flat semiconductor package with half package molding 11 2008
7768135 Semiconductor package with fast power-up cycle and method of making same 11 2008
7808084 Semiconductor package with half-etched locking features 15 2008
8125064 Increased I/O semiconductor package and method of making same 5 2008
8184453 Increased capacity semiconductor package 13 2008
7692286 Two-sided fan-out wafer escape package 47 2008
7847392 Semiconductor device including leadframe with increased I/O 11 2008
7989933 Increased I/O leadframe and semiconductor device including same 9 2008
8008758 Semiconductor device with increased I/O leadframe 8 2008
8089145 Semiconductor device including increased capacity leadframe 3 2008
8072050 Semiconductor device with increased I/O leadframe including passive device 2 2008
7875963 Semiconductor device including leadframe having power bars and increased I/O 15 2008
7982298 Package in package semiconductor device 15 2008
8487420 Package in package semiconductor device with film over wire 1 2008
7863723 Adhesive on wire stacked semiconductor package 10 2008
8680656 Leadframe structure for concentrated photovoltaic receiver package 4 2009
8058715 Package in package device for RF transceiver module 4 2009
7732899 Etch singulated semiconductor package 4 2009
8026589 Reduced profile stackable semiconductor package 26 2009
7960818 Conformal shield on punch QFN semiconductor package 6 2009
7928542 Lead frame for semiconductor package 7 2009
8575742 Semiconductor device with increased I/O leadframe including power bars 6 2009
7977163 Embedded electronic component package fabrication method 18 2009
8796561 Fan out build up substrate stackable package and method 8 2009
8129849 Method of making semiconductor package with adhering portion 0 2009
8937381 Thin stackable package and method 5 2009
8072083 Stacked electronic component package having film-on-wire spacer 2 2010
8089141 Semiconductor package having leadframe with exposed anchor pads 1 2010
7872343 Dual laminate package structure with embedded elements 9 2010
8188584 Direct-write wafer level chip scale package 26 2010
7932595 Electronic component package comprising fan-out traces 21 2010
8324511 Through via nub reveal method and structure 7 2010
7906855 Stacked semiconductor package and method of making same 3 2010
8294276 Semiconductor device and fabricating method thereof 4 2010
8084868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8319338 Thin stacked interposer package 40 2010
8440554 Through via connected backside embedded circuit features structure and method 4 2010
8487445 Semiconductor device having through electrodes protruding from dielectric layer 3 2010
8299602 Semiconductor device including leadframe with increased I/O 0 2010
8143727 Adhesive on wire stacked semiconductor package 6 2010
8791501 Integrated passive device structure and method 3 2010
8674485 Semiconductor device including leadframe with downsets 2 2010
8283767 Dual laminate package structure with embedded elements 3 2010
8188579 Semiconductor device including leadframe having power bars and increased I/O 14 2010
8390130 Through via recessed reveal structure and method 8 2011
8318287 Integrated circuit package and method of making the same 6 2011
8648450 Semiconductor device including leadframe with a combination of leads and lands 1 2011
8102037 Leadframe for semiconductor package 1 2011
8119455 Wafer level package fabrication method 10 2011
8729710 Semiconductor package with patterning layer and method of making same 0 2011
8729682 Conformal shield on punch QFN semiconductor package 0 2011
8441110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 4 2011
8304866 Fusion quad flat semiconductor package 1 2011
8432023 Increased I/O leadframe and semiconductor device including same 1 2011
8823152 Semiconductor device with increased I/O leadframe 0 2011
8558365 Package in package device for RF transceiver module 1 2011
8552548 Conductive pad on protruding through electrode semiconductor device 2 2011
8298866 Wafer level package and fabrication method 7 2012
9129943 Embedded component package and fabrication method 0 2012
9048298 Backside warpage control structure and fabrication method 1 2012
8501543 Direct-write wafer level chip scale package 4 2012
8486764 Wafer level package and fabrication method 4 2012
9324614 Through via nub reveal method and structure 0 2012
8853836 Integrated circuit package and method of making the same 1 2012
9082833 Through via recessed reveal structure and method 0 2013
9362210 Leadframe and semiconductor package made using the leadframe 0 2013
9159672 Through via connected backside embedded circuit features structure and method 0 2013
8691632 Wafer level package and fabrication method 3 2013
8900995 Semiconductor device and manufacturing method thereof 0 2013
8981572 Conductive pad on protruding through electrode semiconductor device 0 2013
8710649 Wafer level package and fabrication method 3 2013
9275939 Semiconductor device including leadframe with a combination of leads and lands and method 0 2013
8963301 Integrated circuit package and method of making the same 0 2013
8952522 Wafer level package and fabrication method 0 2014
9184118 Micro lead frame structure having reinforcing portions and method 0 2014
9184148 Semiconductor package and method therefor 0 2014
9054117 Wafer level package and fabrication method 1 2014
9224676 Integrated circuit package and method of making the same 0 2015
9406645 Wafer level package and fabrication method 1 2015
9543235 Semiconductor package and method therefor 0 2015
9508631 Semiconductor device including leadframe with a combination of leads and lands and method 0 2015
9631481 Semiconductor device including leadframe with a combination of leads and lands and method 0 2016
 
RENESAS ELECTRONICS CORPORATION (2)
* 6611063 Resin-encapsulated semiconductor device 46 2000
* 6433421 Semiconductor device 32 2001
 
BANK OF AMERICA, N.A. (1)
* 2004/0150,086 Semiconductor package having reduced thickness 0 2004
 
SHINKAWA LTD. (2)
7821140 Semiconductor device and wire bonding method 8 2010
* 2010/0237,480 SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD 8 2010
 
KABUSHIKI KAISHA TOSHIBA (4)
* 7755175 Multi-stack chip package with wired bonded chips 5 2006
* 8115290 Storage medium and semiconductor package 1 2009
* 2009/0218,670 STORAGE MEDIUM AND SEMICONDUCTOR PACKAGE 5 2009
* 2010/0255,637 STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 3 2010
 
FUJITSU SEMICONDUCTOR LIMITED (1)
* 6798031 Semiconductor device and method for making the same 19 2002
 
TESSERA, INC. (23)
* 7605479 Stacked chip assembly with encapsulant layer 2 2002
8525314 Stacked packaging improvements 30 2005
9159708 Stackable molded microelectronic packages with area array unit connectors 0 2010
8482111 Stackable molded microelectronic packages 36 2010
8531020 Stacked packaging improvements 0 2010
8728865 Microelectronic packages and methods therefor 27 2011
8637991 Microelectronic package with terminals on dielectric mass 0 2011
8623706 Microelectronic package with terminals on dielectric mass 1 2011
8618659 Package-on-package assembly with wire bonds to encapsulation surface 24 2012
8659164 Microelectronic package with terminals on dielectric mass 29 2012
9093435 Package-on-package assembly with wire bonds to encapsulation surface 7 2013
8969133 Package-on-package assembly with wire bonds to encapsulation surface 0 2013
8907466 Stackable molded microelectronic packages 7 2013
8927337 Stacked packaging improvements 20 2013
8957527 Microelectronic package with terminals on dielectric mass 0 2014
9218988 Microelectronic packages and methods therefor 0 2014
9324681 Pin attachment 0 2014
9123664 Stackable molded microelectronic packages 9 2014
9224717 Package-on-package assembly with wire bonds to encapsulation surface 7 2014
9153562 Stacked packaging improvements 7 2014
9570382 Stackable molded microelectronic packages 0 2015
9570416 Stacked packaging improvements 0 2015
9553076 Stackable molded microelectronic packages with area array unit connectors 0 2015
 
HYNIX SEMICONDUCTOR INC. (2)
* 7834463 Stack package having pattern die redistribution 3 2006
* 2008/0001,304 Stack package having pattern die redistribution 1 2006
 
INVENSAS CORPORATION (25)
9105483 Package-on-package assembly with wire bond vias 7 2012
8836136 Package-on-package assembly with wire bond vias 14 2012
8404520 Package-on-package assembly with wire bond vias 14 2012
8835228 Substrate-less stackable package with wire-bond interconnect 3 2012
9391008 Reconstituted wafer-level package DRAM 0 2012
8975738 Structure for microelectronic packaging with terminals on dielectric mass 0 2012
8878353 Structure for microelectronic packaging with bond elements to encapsulation surface 20 2012
9349706 Method for package-on-package assembly with wire bonds to encapsulation surface 0 2013
9502390 BVA interposer 0 2013
9041227 Package-on-package assembly with wire bond vias 0 2013
9034696 Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation 1 2013
9023691 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation 1 2013
9252122 Package-on-package assembly with wire bond vias 0 2013
9087815 Off substrate kinking of bond wire 0 2013
9583411 Fine pitch BVA using reconstituted wafer with area array accessible for testing 0 2014
9214454 Batch process fabrication of package-on-package microelectronic assemblies 1 2014
8883563 Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation 10 2014
9646917 Low CTE component with wire bond interconnects 0 2014
9412714 Wire bond support structure and microelectronic package including wire bonds therefrom 0 2014
9082753 Severing bond wire by kinking and twisting 0 2014
9095074 Structure for microelectronic packaging with bond elements to encapsulation surface 10 2014
9615456 Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface 0 2015
9601454 Method of forming a component having wire bonds and a stiffening layer 0 2015
9356006 Batch process fabrication of package-on-package microelectronic assemblies 0 2015
9633979 Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation 0 2016
 
MICRO-OPTIMUS TECHNOLOGIES, INC. (1)
* 7250686 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded 0 2006
 
LAPIS SEMICONDUCTOR CO., LTD. (5)
6580164 Semiconductor device and method of manufacturing same 13 2000
6777801 Semiconductor device and method of manufacturing same 2 2003
7414320 Semiconductor device and method of manufacturing same 5 2005
* 2005/0181,539 Semiconductor device and method of manufacturing same 3 2005
* 7705469 Lead frame, semiconductor device using same and manufacturing method thereof 4 2008
 
OKI SEMICONDUCTOR CO., LTD. (4)
* 6836010 Semiconductor device include relay chip connecting semiconductor chip pads to external pads 7 2003
* 2004/0017,003 Semiconductor device and method of producing the same 0 2003
6905913 Semiconductor device and method of manufacturing same 4 2004
* 2004/0262,775 Semiconductor device and method of manufacturing same 0 2004
 
SHARP KABUSHIKI KAISHA (1)
RE41826 Semiconductor device 4 2007
 
TESSERA ADVANCED TECHNOLOGIES, INC. (1)
* 6777796 Stacked semiconductor chips on a wiring board 3 2002
 
CHIPPAC, INC. (2)
* 2004/0061,213 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages 179 2003
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides 5 2007
 
FUJITSU LIMITED (2)
* 6882045 Multi-chip module and method for forming and method for deplating defective capacitors 44 2001
* 2002/0155,661 Multi-chip module and method for forming and method for deplating defective capacitors 17 2001
 
CHIPMOS TECHNOLOGIES INC. (1)
* 2009/0146,278 Chip-stacked package structure with asymmetrical leadframe 1 2007
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
* 7288841 Laminated semiconductor package 19 2006
 
Pulsic Limited (22)
7784010 Automatic routing system with variable width interconnect 24 2004
7131096 Method of automatically routing nets according to current density rules 29 2004
7257797 Method of automatic shape-based routing of interconnects in spines for integrated circuit design 36 2005
7363607 Method of automatically routing nets according to parasitic constraint rules 19 2005
7530040 Automatically routing nets according to current density rules 13 2006
7373628 Method of automatically routing nets using a Steiner tree 9 2006
9245082 High-speed shape-based router 2 2006
7603644 Integrated circuit routing and compaction 9 2006
7823113 Automatic integrated circuit routing using spines 11 2006
8095903 Automatically routing nets with variable spacing 11 2006
8099700 Automatic integrated circuit routing using spines 11 2007
7802208 Design automation using spine routing 19 2007
8171447 Automatically routing nets according to current density rules 2 2009
7984411 Integrated circuit routing and compaction 0 2009
8458636 Filling vacant areas of an integrated circuit design 0 2010
8479139 Automatic routing system with variable width interconnect 6 2010
8332805 Automatically routing nets according to parasitic constraint rules 5 2011
8332799 Integrated circuit routing with compaction 0 2011
8949760 Automatically routing nets with variable spacing 1 2012
8479141 Automation using spine routing 6 2012
8751996 Automatically routing nets according to parasitic constraint rules 5 2012
8707239 Integrated circuit routing with compaction 2 2012
 
SITIME CORPORATION (4)
* 8669664 Stacked die package for MEMS resonator system 1 2012
* 2013/0075,853 Stacked Die Package for MEMS Resonator System 1 2012
8941247 Stacked die package for MEMS resonator system 2 2014
9371221 Low-profile stacked-die MEMS resonator system 0 2015
 
SANDISK TECHNOLOGIES LLC (2)
* 2009/0321,501 METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE 8 2008
* 2009/0321,952 WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE 5 2008
 
NATIONAL SEMICONDUCTOR CORPORATION (27)
* 6707140 Arrayable, scaleable, and stackable molded package configuration 43 2000
6624507 Miniature semiconductor package for opto-electronic devices 32 2001
6642613 Techniques for joining an opto-electronic module to a semiconductor package 7 2001
7023705 Ceramic optical sub-assembly for optoelectronic modules 2 2002
6973225 Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package 1 2002
6916121 Optical sub-assembly for optoelectronic modules 5 2002
* 2003/0026,556 Optical sub-assembly for optoelectronic modules 2 2002
6765275 Two-layer electrical substrate for optical devices 0 2002
6767140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology 6 2003
* 2003/0165,303 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC ( low-temperature co-fired ceramic ) technology 0 2003
6858468 Techniques for joining an opto-electronic module to a semiconductor package 2 2003
7156562 Opto-electronic module form factor having adjustable optical plane height 24 2003
6985668 Multi-purpose optical light pipe 0 2003
* 2005/0013,560 Opto-electronic module form factor having adjustable optical plane height 3 2003
6838317 Techniques for joining an opto-electronic module to a semiconductor package 0 2003
* 2004/0048,417 Techniques for joining an opto-electronic module to a semiconductor package 0 2003
7086786 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology 0 2004
* 2004/0213,525 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology 0 2004
7432575 Two-layer electrical substrate for optical devices 0 2004
* 2004/0216,918 Two-layer electrical substrate for optical devices 0 2004
7247942 Techniques for joining an opto-electronic module to a semiconductor package 3 2004
* 2005/0100,294 Techniques for joining an opto-electronic module to a semiconductor package 33 2004
7199440 Techniques for joining an opto-electronic module to a semiconductor package 0 2004
* 2005/0117,835 Techniques for joining an opto-electronic module to a semiconductor package 8 2004
7086788 Optical sub-assembly for opto-electronic modules 3 2005
7269027 Ceramic optical sub-assembly for optoelectronic modules 0 2006
* 2006/0140,534 Ceramic optical sub-assembly for optoelectronic modules 0 2006
 
ROBERT BOSCH GMBH (2)
* 7083077 Method and contact point for establishing an electrical connection 3 2002
7906858 Contact securing element for bonding a contact wire and for establishing an electrical connection 0 2006
 
SIMPLEX SOLUTIONS, INC. (3)
6795958 Method and apparatus for generating routes for groups of related node configurations 8 2002
6952815 Probabilistic routing method and apparatus 9 2002
* 2003/0088,845 Probabilistic routing method and apparatus 1 2002
 
MITSUBISHI DENKI KABUSHIKI KAISHA (3)
* 6633078 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal 65 2001
6905911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal 6 2003
* 2004/0021,212 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal 8 2003
 
TEXAS INSTRUMENTS INCORPORATED (4)
* 6583483 Semiconductor device and its manufacturing method 5 2001
* 6780749 Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges 48 2003
7573137 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices 1 2006
* 2007/0228,543 Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semiconductor Devices 9 2006
* Cited By Examiner