Semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 13, 2001
Grant Date -
N/A
app pub date -
Jul 25, 2000
filing date -
Feb 16, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sensor substrate (2) is mounted on a signal processing substrate (1), and a sealing resin (3) is so provided as to extend from an edge portion of the sensor substrate (2) onto a main surface of the signal processing substrate (1). The sealing resin (3) is provided over the whole outer peripheral region of the sensor substrate (2), and the sealing resin (3), the sensor substrate (2) and the signal processing substrate (1) define the sealed space (SP). The sensor substrate (2) has a plurality of bumps (21) on its main surface and makes an electrical connection with the signal processing substrate (1) by bonding the bumps (21) to an electrode provided on the main surface of the signal processing substrate (1). With this structure, a semiconductor device which allows reduction in manufacturing cost by omitting a cap which protects moving part of the sensor substrate can be achieved.
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