Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
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United States of America Patent
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Nov 20, 2001
Issued Date -
N/A
app pub date -
Jan 20, 2000
filing date -
May 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
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