Method and apparatus for cleaning low K dielectric and metal wafer surfaces
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United States of America Patent
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Nov 20, 2001
Issued Date -
N/A
app pub date -
Jul 18, 2000
filing date -
Sep 29, 1998
priority date (Note) -
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Abstract
Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (b) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.
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