Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe
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United States of America Patent
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-
Nov 20, 2001
Grant Date -
N/A
app pub date -
Dec 1, 1999
filing date -
Dec 1, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making an integrated circuit package is disclosed. A conductive first adhesive is applied onto a leadframe pad of a leadframe. A conductive second adhesive is applied on an input portion of the leadframe, such as a leadframe member that is integral with inner portions of input leadfingers. An integrated circuit die, such as a power MOSFET, is placed on the first adhesive on the leadframe pad. A conductive third adhesive is applied onto a surface of the integrated circuit die opposite the leadframe pad. A conductive strap is placed on the third adhesive on the integrated circuit die and on the second adhesive on the leadframe. The first, second and third adhesives are then simultaneously cured so that the integrated circuit die is permanently attached to the leadframe pad, and the conductive strap is permanently attached to the die and the leadframe member.
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