Enhanced interconnection to ceramic substrates
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United States of America Patent
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Nov 20, 2001
Grant Date -
N/A
app pub date -
Aug 18, 1999
filing date -
Aug 18, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE. An insulation coating on the thin metal plate is also included on walls of the through holes. An electrical conductive material fills each of the insulated through holes for electrical interconnection between the first component and the second component.
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