Reflow selective shorting
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United States of America Patent
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-
Nov 20, 2001
Grant Date -
N/A
app pub date -
Nov 12, 1998
filing date -
Nov 12, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bridge structure is utilized on a circuit board. The bridge structure includes a first element, a second element and a gap between the first element and a second element. Soder paste is capable of flowing when the circuit board is heated, such that the paste on the first element comes into contact with paste on the second element. The paste solidifies when cooled such that solidified paste serves to connect the first element and the second element. The first and second elements can be L-shaped.
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