Electronic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 20, 2001
Grant Date -
N/A
app pub date -
Jul 12, 2000
filing date -
Jul 12, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of conductive traces arranged at the periphery of the ground ring and the power ring. The electronic package comprises at least a surface-mountable device connected across the ground ring and the power ring. The present invention is characterized in that the surface-mountable device has at least a bonding region formed on one end contact thereof for bonding to a bonding wire thereby allowing the chip to be electrically connected to the ground ring or power ring directly through the end contact of the surface-mountable device.
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