Stackable flex circuit IC package and method of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 27, 2001
Grant Date -
N/A
app pub date -
May 5, 1999
filing date -
May 5, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern at the edge portion. An IC device is mounted within a central aperture in the frame, and is electrically coupled to the conductive pattern. The IC device is sealed in place within the frame with epoxy. A stack of the IC packages is assembled by disposing a conductive epoxy of anisotropic material between the conductive patterns at the edge portions of adjacent IC packages. Application of pressure in a vertical or Z-axis direction between adjacent IC packages completes electrical connections between the individual conductors of the conductive patterns of adjacent IC packages to interconnect the IC packages of the stack, while at the same time maintaining electrical isolation between adjacent conductors within each of the conductive patterns.
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