Differential pair geometry for integrated circuit chip packages
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United States of America Patent
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Nov 27, 2001
Issued Date -
N/A
app pub date -
Jan 19, 2000
filing date -
Dec 18, 1996
priority date (Note) -
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Abstract
An integrated circuit chip package is provided which incorporates one or more differential pairs of signal lines coupled to an integrated circuit chip. The differential pairs each include a first signal line and a second signal line. The first signal lines are non-coplanar with the second signal lines. The first signal lines of the differential pairs may be provided in a first plane. The second signal lines of the differential pairs may be provided in a second plane different from the first plane. A first ground plane is provided adjacent the first signal lines and a second ground plane is provided adjacent the second signal lines. The spacing of respective signal lines provides, among other things, the capability of having a greater density of differential pairs of signal lines within the planar area of an integrated circuit chip package.
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