Mounting structure for semiconductor device

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United States of America Patent

PATENT NO 6323426
SERIAL NO

09222313

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A mounting structure for a high temperature superconductor device, such as a filter, housed in a closed vacuum chamber and operated at a low temperature. The filter has dielectric substrate having: first and second surfaces; a circuit portion made of a superconducting thin film formed on the first surface of the dielectric substrate; and a ground layer consisting of a superconducting thin film formed on second surface of the dielectric substrate and a metal film deposited on the superconducting thin film. The mounting structure comprises: a device holder for holding the filter thereon; a conductive layer intervening between the ground layer of the filter and the device holder; urging parts for resiliently urging the filter toward the device holder. The conductive layer is made of a metal selected from among the group consisting of gold, silver, copper, aluminum and an alloy made of at least one of gold, silver, copper, and aluminum. The mounting structure can securely ground the ground layer of the filter enough to have an extremely low contact resistance as well as can have the amount of the released gas restricted.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED MOBIL TELECOMMUNICATION TECHNOLOGY INC500-1 MINAMIYAMA KOMENOKI-CHO NISSHIN-SHI AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuse, Masashi Nisshin, JP 16 281
Hoshizaki, Hiroki Nisshin, JP 9 70

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