High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
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United States of America Patent
Stats
-
Nov 27, 2001
Grant Date -
N/A
app pub date -
Apr 8, 1997
filing date -
Apr 8, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a printed circuit board, and a method of preparing a printed circuit board, which possesses a coefficient of thermal expansion substantially similar to that of silicon for use in direct semiconductor chip attach structures and similar solder mounted devices. The printed circuit board is fabricated from prepreg having a thermosetting resin and a reinforcement layer consisting of non-woven aramid mat or a liquid crystalline polymer paper. The composite dielectric layer optionally includes plated through holes which are either filled or non-filled, and one or more thin film redistribution layers to provide high density electronic packages. The design places the solder pads at the PTHs where needed. The redistribution layer can be formed using photoimagable dielectrics or laminated controlled-CTE composites and laser via imaging.
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