Vertical spark gap for microelectric circuits
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United States of America Patent
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-
Nov 27, 2001
Grant Date -
N/A
app pub date -
Feb 9, 1999
filing date -
Feb 21, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A vertical spark gap assembly for electronic circuits employing poly silicon. The assembly permits dissipation of higher voltages in spark discharge without shorting in the circuit. The spark gap assembly includes a first partially conductive layer and a second partially conductive layer and a non-conductive material positioned between the layers and maintaining a vertically spaced apart relationship therebetween. At least one opening is provided in the first layer and the second layer with the non-conductive material removed from the layer having at least one opening. As such, the arrangement provides a vertical gap formed between and communicating with each layer.
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