Apparatus capable of high power dissipation during burn-in of a device under test
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United States of America Patent
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-
Nov 27, 2001
Grant Date -
N/A
app pub date -
Oct 6, 1998
filing date -
Oct 7, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.
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