Heat transfer interface
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United States of America Patent
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-
Nov 27, 2001
Grant Date -
N/A
app pub date -
Aug 15, 2000
filing date -
Aug 15, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat transfer interface is disclosed. The surface of the heat dissipating panel of a radiator formed by a heat dissipating substrate is machined, and then a second heat transfer layer is added thereon. The heat transfer layer is connected to the heat dissipating substrate through plating, physical vapor deposition, hot forging, or soldering. The second heat dissipating layer is a thin layer for enhancing the lightness of the contact surface of the heat dissipating substrate, reducing the hole gap on the surface of the heat dissipating substrate, reducing the amount of the soft filling material, reducing the filling thickness of the soft filling material, increasing the heat spreading, and thus reducing contact resistance.
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