Microelectronic component of sandwich construction
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United States of America Patent
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-
Nov 27, 2001
Issued Date -
N/A
app pub date -
Mar 30, 1999
filing date -
Sep 30, 1996
priority date (Note) -
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Abstract
A microelectronic component of sandwich construction, that includes a first substrate with a first conductor track plane and a second substrate with a second conductor track plane, between which many semiconductor chips are disposed. The contacting of the second conductor track plane to the adjacent surface of the semiconductor chips is effected by fixed contacting means, in particular with the soldered connections, an electrically conductive adhesive, or electrically conductive balls. The microelectronic components of the invention are suitable in particular as power components and can be used for instance in inverters. The invention also relates to a method for producing the microelectronic component.
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