Method for fabricating microelectronic assemblies
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United States of America Patent
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Dec 4, 2001
Grant Date -
N/A
app pub date -
Mar 25, 1998
filing date -
Mar 25, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solder ball and keeps the solder ball down in the desired position thereby minimizing variations in height of the resulting solder bumps. Also, the solder pad may include non-wettable surfaces defined by a non-wettable metal, a metal compound or a dielectric material. The non-wettable areas on the pad confine the solder and avoid the need for a separate solder mask.
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