Apparatus for applying a liquid coating with an improved spray nozzle
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United States of America Patent
Stats
-
Dec 4, 2001
Grant Date -
Nov 22, 2001
app pub date -
Jun 19, 1997
filing date -
Jul 19, 1996
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Apparatus and methods for spray coating selected areas of a circuit board with a liquid coating material without coating regions of the circuit board to be left uncoated. In one mode of operation, a bead of liquid coating material dispensed from an elongated nozzle tip is atomized by directing jets of air pressurized against the bead to form a conical, swirling spray pattern which is sprayed on selected areas of a circuit board. In a second mode of operation, the non-atomized bead of liquid coating material dispensed through the elongated nozzle tip is applied on selected areas of the circuit board. In a third mode of operation, jets of pressurized air are directed against the bead of liquid coating material to create a soft swirl pattern, without atomizing the bead of coating material. In a second embodiment of the invention, the bead of liquid coating material is dispensed from a nozzle without the elongated nozzle tip.
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