Reworkable thermoplastic hyper-branched encapsulant
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United States of America Patent
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Dec 4, 2001
Issued Date -
N/A
app pub date -
Jun 4, 1999
filing date -
Dec 30, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A).sub.n RB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof Also disclosed is a method of encapsulating a circuit assembly using the encapsulant of the invention.
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