Apparatus for packaging semiconductor device and method for packaging the same
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United States of America Patent
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-
Dec 4, 2001
Grant Date -
N/A
app pub date -
Feb 16, 1999
filing date -
Dec 31, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for packaging a semiconductor device and a method for packaging the same. The apparatus includes a closed printing chamber having a baseplate on the bottom of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank is located in the closed printing chamber.
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